Heat dissipating module

ABSTRACT

A heat dissipating module includes a base, at least one thermal conductive element, at least one liquid-pipe and a heat sink. The thermal conductive element is disposed at the base. The liquid-pipe is disposed adjacent to the thermal conductive element. The liquid-pipe is disposed at the base. The heat sink covers the thermal conductive element and the liquid-pipe. A part of the heat sink is connected to the base. The heat sink includes a plurality of fins. The heat dissipating module combines air-cooling with water-cooling so as to enhance thermal conductivity.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of U.S. provisional patentapplication Ser. No. 61/597,844, filed on Feb. 13, 2012. The entirety ofthe above-mentioned patent application is hereby incorporated byreference herein and made a part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a heat dissipating module and, moreparticularly, to a heat dissipating module combining air-cooling andwater-cooling.

2. Description of the Related Art

As execution efficiency and functions of a computer are improved andprocessing speed enhances, the central processing unit (CPU) or otherelectronic elements at a motherboard generates more heat due to highfrequency oscillation and electromagnetic effect after a long timeusage. If the heat is not dissipated instantly, the electronic elementsmay be damaged or affected.

Conventionally, a heat dissipater is disposed at a heat source toconduct the heat from the heat source to fins of the heat dissipater,and then cool air is blown to the fins of the heat dissipater and theheat is brought out via a fan and air circulation. The heat dissipaterincludes a base connecting to the electronic elements and a plurality ofthe fins disposed at the base. The base is usually a smooth metal platewhich can conduct heat. The base contacts with the surface of theelectronic elements to absorb the heat from the electronic elements, andthe heat is conducted to the fins for dissipating. However, the heatdissipater is limited by the inner height and the weight of the system.Furthermore, when it is applied to a CPU with a high wattage (such as130 W or more), a fan with higher rotating speed is needed, the noise istoo loud and the heat dissipating efficiency is poor.

Furthermore, a water-cooling method cooperating with a pump forcirculating hot and cold water is also used to dissipate heat. However,in a high-level system or electronic device, the heat dissipating effectof air-cooling or liquid cooling is limited due to the device size andthe using circumstance.

BRIEF SUMMARY OF THE INVENTION

A heat dissipating device applied to an electronic device is disclosed.The heat dissipating device simplifies elements in a conventional heatdissipating module, and combines air-cooling with liquid cooling in alimited space to improve the whole heat dissipating efficiency andmaintain the working performance of the electronic device effectively.

A heat dissipating module includes a base, at least a thermal conductiveelement, at least a liquid-pipe and a heat sink. The thermal conductiveelement is disposed at the base. The liquid-pipe is adjacent to thethermal conductive element and is disposed at the base. The heat sinkcovers the thermal conductive element and the liquid-pipe. At least apart of the heat sink is connected to the base. The heat sink includes aplurality of fins. The heat dissipating module is disposed at a circuitboard.

A heat dissipating module includes a base, at least a thermal conductiveelement, a heat sink and at least a liquid-pipe. The thermal conductiveelement is disposed at the base. The heat sink covers the thermalconductive element and at least a part of the heat sink is connected tothe base. The heat sink includes a plurality of fins. The fins includeat least a recess, respectively. The liquid-pipe is disposed in therecess of the fins. Two sides of the heat sink cover the thermalconductive element and the liquid-pipe, respectively.

The heat dissipating module includes the thermal conductive element andthe liquid-pipe in a limited space instead of including only theair-cooling device or the water-cooling device to increase heatdissipating speed greatly. Moreover, the heat dissipating module hasmore heat dissipating paths, which further improves heat dissipatingefficiency.

These and other features, aspects and advantages of the presentinvention will become better understood with regard to the followingdescription, appended claims, and accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is an exploded diagram showing a heat dissipating module in afirst embodiment;

FIG. 1B is an schematic diagram showing the assembled heat dissipatingmodule in FIG. 1A;

FIG. 1C is a sectional schematic diagram showing the heat dissipatingmodule in FIG. 1B;

FIG. 2 is a sectional schematic diagram showing a heat dissipatingmodule in a second embodiment;

FIG. 3A is a schematic diagram showing an electronic device applying aheat dissipating module in an embodiment;;

FIG. 3B is an exploded diagram showing an electronic device applying aheat dissipating module in an embodiment;

FIG. 4A is an exploded diagram showing a heat dissipating module in athird embodiment;

FIG. 4B is a schematic diagram showing the assembled heat dissipatingmodule in FIG. 4A;

FIG. 5A is an exploded diagram showing a heat dissipating module in afourth embodiment; and

FIG. 5B is a schematic diagram showing the assembled heat dissipatingmodule in FIG. 5A.

DETAILED DESCRIPTION OF THE EMBODIMENTS

A heat dissipating module is illustrated with relating figures, and thesame symbols denote the same components.

FIG. 1A is an exploded diagram showing a heat dissipating module in afirst embodiment, and FIG. 1B is an schematic diagram showing theassembled heat dissipating module in FIG. 1A. Please refer to FIG. 1Aand FIG. 1B, the heat dissipating module A includes a base 1, at least athermal conductive element T. In the embodiment, the thermal conductiveelement includes a heat pipe 2, at least a liquid-pipe 3 and a heat sink4. The heat pipe 2 including the thermal conductive element T is takenas an example. The heat dissipating module A is disposed at a circuitboard or other heat sources (such as an electronic element) via the base1. The structure and components of the heat dissipating module A areillustrated first, and practical usage of the heat dissipating module Awith the electronic device would be described later.

As shown in FIG. 1A and FIG. 1B, the heat pipe 2 and the liquid-pipe 3are adjacently disposed at a same surface of the base 1. The base 1 maybe made of high thermal conductive material, such as copper, silver,aluminum or alloy, which is not limited herein. The bottom of the base 1contacts with a heat source of the electronic device, such as a CPU, achipset or a passive element.

The heat from the heat source of the electronic device is conducted viathe base 1, and the base 1 may accommodate the heat pipe 2 and theliquid-pipe 3 to increase contacting area therebetween, so that the heatcan be conducted and dissipated evenly and rapidly via the heat pipe 2and the liquid-pipe 3.

The base 1 includes two recesses 11, and the two recesses 11 contactwith and accommodate the heat pipe 2 and the liquid-pipe 3,respectively. The two recesses 11 are disposed at a same side of thebase 1, and the heat pipe 2 and the liquid-pipe 3 are disposed in thetwo recesses 11 of the base 1, respectively. The side for the recesses11 is opposite to that of the heat source. The recesses 11 of the base 1accommodate a part of the heat pipe 2 and the liquid-pipe 3, fix them inthe base 1, and increase the contacting area therebetween, so as toimprove the heat conducting efficiency.

In the embodiment, the heat pipe 2 is a long, thin, hollow metal pipewith two closed ends. The shape and size of the heat pipe 2 are notlimited and determined by the circumstance, disposing space, heatconduction and temperature or others. An inner wall of the heat pipe 2includes wick structures which have liquid inside, and the liquid iscalled working medium of the heat pipe.

The liquid-pipe 3 is also a hollow pipe and has a smooth inner wall. Inthe embodiment, the liquid-pipe 3 may also include wick structures toimprove water-cooling effect, which is not limited herein. Other pipeswhich have cooling liquid flowing inside are also within the scope.

The heat pipe 2 and the liquid-pipe 3 may be welded onto the base 1.Solder, a tin bar or solder paste may be put in the recesses 11 of thebase 1 first, and then the heat pipe 2 and the liquid-pipe 3 are putinto the recesses 11 of the base 1 for welding, which is not limitedherein. The heat pipe and the liquid-pipe also may be fixed to the basein other methods.

In the embodiment, two ends of the liquid-pipe 3 include a joint 31,respectively. The joint 31 may be welded to the ends of the liquid-pipe3, and the liquid-pipe 3 can be connected to a water-cooling element(such as a water tank or a pump) via the joint 31. The liquid-pipe isintegrally formed along three directions of an x-y-z coordinate. Thejoint 31 may also be fixed at the ends of the liquid-pipe 3 by insertingor locking, which is not limited herein.

The heat sink 4 covers the heat pipe 2 and the liquid-pipe 3. The heatsink 4 includes a plurality of fins 41. The fins 41 include at least tworecesses 411, respectively. The recesses 411 of the fins 41 cover andcontact with the heat pipe 2 and the liquid-pipe 3, respectively. Therecesses 411 of the fins 41 accommodate a part of the heat pipe 2 andthe liquid-pipe 3 to increase the contacting area therebetween andimprove the heat conducting efficiency, which is the same as therecesses 11 of the base 1. The fins 41 may be made by aluminum extrusionor aluminum die-casting, which is not limited herein.

In FIG. 1A and FIG. 1B, the fins 41 are arranged at intervals obliquelyto form the heat sink 4, but the number, the size and arrangement of thefins 41 are not limited. The fins 41 may be also arranged at intervalshorizontally or vertically to form the heat sink according to thestructure of the electronic device, layout of other elements and thewhole heat dissipating requirements.

In the embodiment, at least a part of the heat sink 4 is connected tothe base 1, and it may be welded onto the heat pipe 2, the liquid-pipe 3and the base 1. The heat sink 4 may also be disposed at the heat pipe 2,the liquid-pipe 3 and the base 1 via inserting, locking, fixing orpasting, which is not limited herein.

FIG. 1C is a sectional schematic diagram showing the heat dissipatingmodule in FIG. 1B. The heat dissipating module A with a heat source S isused to illustrate the heat conducting path. In the embodiment, the heatpipe 2 does not contact with the liquid-pipe 3. The heat source S (suchas a CPU) gives out heat. When the base 1 contacts with the heat sourceS at a higher temperature, the heat conducting starts. After the heat isconducted from the heat source S to the base 1, it is conducted to theheat pipe 2 and the liquid-pipe 3.

As stated above, the heat is conducted to the heat pipe 2 via a path L1,and transferred to the liquid-pipe 3 via a path L2 at the same time.After the heat is conducted to the heat pipe 2 via the path L1, it canbe further conducted to the fins 41 via a path L3, and it is dissipatedvia other heat dissipaters (such as a fan). The heat conducted to thefins 41 can not only be dissipated via air-cooling, but also conductedto the liquid-pipe 3 via a path L4 in a water-cooling manner.

The heat conducting medium for heat transferring through can be reducedvia the structure that the heat pipe 2 adjacent to the liquid-pipe 3,and the heat dissipating paths are increased to improve the heatdissipating efficiency. Moreover, the size of the heat dissipatingmodule can be reduced, and thus the space in the electronic device fordisposing the heat dissipating module is saved.

FIG. 2 is a sectional schematic diagram showing a heat dissipatingmodule in a second embodiment. In the embodiment, the heat dissipatingmodule A′ has similar structures and features with that of the heatdissipating module A, and the difference is that the heat pipe 2′disposed at the base 1′ contacts with the liquid-pipe 3′. The heatconducting paths from the heat source S to the heat dissipating moduleA′ are similar to the paths in the above embodiment, and they furtherinclude a path L5. Moreover, the heat pipe 2′ is taken as an example ofthe thermal conductive element T in the embodiment.

Since the heat pipe 2′ contacts with the liquid-pipe 3′, the heat can beconducted from the heat pipe 2′ to the liquid-pipe 3′ via the path L5directly, and it does not need to be conducted from the fins 41′ of theheat sink 4′ to the liquid-pipe 3′ via the path L3 and the path L4.Thus, the heat passes through less conducting medium and the heatdissipating path is further shortened, which improves the whole heatdissipating efficiency.

FIG. 3A is a schematic diagram showing an electronic device applying aheat dissipating module in an embodiment, and FIG. 3B is an explodeddiagram showing an electronic device applying a heat dissipating modulein an embodiment.

As shown in FIG. 3A and FIG. 3B, the electronic device E at leastincludes a circuit board I and at least a heat dissipating module A. Theheat dissipating module A has a similar structure and features with thatof the heat dissipating module in the above embodiment, which is omittedherein. The heat dissipating module A is disposed at the electronicelements d at the circuit board I, and contacts with the electronicelements d. In the embodiment, the electronic device E may be amotherboard or an electronic device which includes heat sources, whichis not limited herein. Since the electronic elements d give out heat inoperation, the heat dissipating module A dissipates the heat from theelectronic elements d to maintain normal operation temperature.

In the embodiment, the heat dissipating module A further includes aliquid cooling set 5. The liquid cooling set 5 is connected to the joint31 of the liquid-pipe 3 via a pipe P. The liquid cooling set 5 includesa liquid container (such as a water tank) and a pump. The liquid-pipe 3is connected to the liquid cooling set 5, and drives the liquid insideto flow via the pump in the liquid cooling set 5, so as to form awater-cooling circulation mechanism.

In the embodiment, the liquid-pipe 3 is connected to the liquid coolingset 5 via the joint 31 and the pipe P. Furthermore, an end of the heatsink 4 has a hole 42. The joint 31 and the hole 42 can fix the heat sink4 on the heat pipe 2 and the liquid-pipe 3 via locking, so as toincrease the contacting area between the fins 41, the heat pipe 2 andthe liquid-pipe 3 to improve the heat dissipating effect. The joint 31may be combined with the hole 42 via inserting or locking to fix theliquid-pipe and the fins, and the joint 31 may be a quick-release joint,which is not limited herein.

The heat dissipating module A is directly disposed at the electronicelements d, and connected to the electronic elements d via the base 1.The connecting method may be locking, inserting or welding, which is notlimited herein. The size, the number of the heat pipe 2 and theliquid-pipe 3, and the connection therebetween are determined by heatdissipating requirements and the structure of the electronic device. Theelectronic device may further include other heat dissipating elements,such as a fan.

FIG. 4A is an exploded diagram showing a heat dissipating module in athird embodiment, and FIG. 4B is a schematic diagram showing theassembled heat dissipating module in FIG. 4A. As shown in FIG. 4A andFIG. 4B, in the embodiment, the heat dissipating module Al has a similarstructure and features with that of the heat dissipating module A in theabove embodiment. The difference is that the thermal conductive elementincludes a thermal conductive sheet 6. The thermal conductive sheet 6 istaken as an example of the thermal conductive element T. The thermalconductive sheet 6 is adjacent to the liquid-pipe 3 and disposed at thebase 1 a. The heat sink 4 a includes a recess 411 and the base 1 aincludes a recess 11, and the recesses contact with and accommodate theliquid-pipe 3. The heat from the base 1 a can be conducted to the fins41 a more evenly via the thermal conductive sheet 6, so as to improvethe heat dissipating effect.

The thermal conductive sheet 6 may be a rectangular sheet made of heatconductive material (such as metal or alloy), and its size can beadjusted according to the heat dissipating requirements. The thermalconductive sheet 6 may be integrally formed with the base 1 a, which isnot limited herein, and thus the heat passes through less medium and theheat dissipating efficiency is improved.

FIG. 5A is an exploded diagram showing a heat dissipating module in afourth embodiment, and FIG. 5B is a schematic diagram showing theassembled heat dissipating module in FIG. 5A. In the embodiment shown inFIG. 5A and FIG. 5B, the heat dissipating module A2 includes similarelements with those of the heat dissipating module A in the aboveembodiment. The difference is that the base 1 b includes at least arecess 11 which contacts with and accommodates the thermal conductiveelement T. In the embodiment, the thermal conductive element T is theheat pipe 2, and the disposing side of the recess 11 is opposite to thatof the heat source. The heat sink 4 b is disposed on the heat pipe 2 andcovers the heat pipe 2. The heat sink 4 b includes at least two recesses411 b and 412 b. The recesses 411 b and 412 b are disposed at twoopposite sides of the heat sink 4 b. The recess 411 b is disposed at afirst surface of the fins near the heat pipe 2, and the heat sink 4 b atleast accommodates a part of the heat pipe 2 via the recesses 411 b. Therecess 412 b disposed at a second surface of the heat sink 4 baccommodates the liquid-pipe 3, and the heat pipe 2 and the liquid-pipe3 contact with the fins 41 b. Thus, the contacting area between the heatpipe 2 and the fins 41 b, between the liquid-pipe 3 and the fins 41 b isincreased, and the heat conducting efficiency therebetween is improved.

In the embodiment, the connections between the base 1 b and the heatpipe 2, the heat pipe 2 and the heat sink 4 b, the heat sink 4 b and theliquid-pipe 3 may be via welding, pasting or screw locking, which is notlimited herein.

In sum, the heat dissipating module applied to the electronic devicecombines the air-cooling and the water-cooling. The heat dissipatingmodule conducts heat from the heat source (such as an electronicelement) to a side opposite to that of the heat source evenly via thethermal conductive sheet, the heat is further conducted to the finsalong the path of the heat pipe via the structure of the heat pipe andthe liquid-pipe, and a heat dissipater (such as a fan) also may be usedto dissipate the heat in cooperation. The heat dissipating module alsoincludes multiple heat conducting paths including a path from the baseto the liquid-pipe, a path from the heat pipe to the fins, and a pathfrom the fins to the liquid-pipe. After the heat is conducted to theliquid-pipe, the liquid absorbing the heat inside flows to form acirculation and takes the heat away.

Although the present invention has been described in considerable detailwith reference to certain preferred embodiments thereof, the disclosureis not for limiting the scope. Persons having ordinary skill in the artmay make various modifications and changes without departing from thescope. Therefore, the scope of the appended claims should not be limitedto the description of the preferred embodiments described above.

What is claimed is:
 1. A heat dissipating module disposed at a circuitboard, comprising: a base; at least a thermal conductive elementdisposed at the base; at least a liquid-pipe adjacent to the thermalconductive element and disposed at the base; and a heat sink coveringthe thermal conductive element and the liquid-pipe, wherein at least apart of the heat sink is connected to the base, and the heat sinkincludes a plurality of fins.
 2. The heat dissipating module accordingto claim 1, wherein two ends of the liquid-pipe have a joint,respectively.
 3. The heat dissipating module according to claim 1,wherein the thermal conductive element includes a heat pipe or a thermalconductive sheet.
 4. The heat dissipating module according to claim 1,wherein the base includes at least two recesses, the recesses contactwith and accommodate the thermal conductive element and the liquid-pipe,respectively, and the recesses are disposed at a same surface with thebase.
 5. The heat dissipating module according to claim 1, wherein theheat dissipating module further includes: a liquid cooling set connectedto the liquid-pipe.
 6. The heat dissipating module according to claim 1,wherein the fins includes at least two recesses, and the recessescontact with the thermal conductive element and the liquid-pipe,respectively.
 7. The heat dissipating module according to claim 1,wherein the liquid-pipe is integrally formed along three directions ofan x-y-z coordinate.
 8. A heat dissipating module disposed at a circuitboard, comprising: a base; at least a thermal conductive elementdisposed at the base; a heat sink covering the thermal conductiveelement, wherein at least a part of the heat sink is connected to thebase, the heat sink includes a plurality of fins, and the fins includesmultiple recesses, respectively; and at least a liquid-pipe disposed inthe recesses of the fins, wherein the recesses of the heat sink coverthe thermal conductive element and the liquid-pipe.
 9. The heatdissipating module according to claim 8, wherein two ends of theliquid-pipe have a joint, respectively.
 10. The heat dissipating moduleaccording to claim 8, wherein the thermal conductive element includes aheat pipe or a thermal conductive sheet.
 11. The heat dissipating moduleaccording to claim 8, wherein the base includes at least a recess, andthe recess contacts with and accommodates the thermal conductiveelement.
 12. The heat dissipating module according to claim 8, whereinthe heat dissipating module further includes: a liquid cooling setconnected to the liquid-pipe.
 13. The heat dissipating module accordingto claim 8, wherein the recess of the heat sink contacts with theliquid-pipe.
 14. The heat dissipating module according to claim 8,wherein the liquid-pipe is integrally formed along three directions ofan x-y-z coordinate.